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伊春50W电阻 黄金铝壳电阻
特征Features
?散热的铝合金外壳
Aluminum case for heat dissipation
For thermal panel installed
?体积小,功率负荷大
Small size,big power load
?硅铜薄膜,绝缘性好
Silicon copper film forming,good insulation
?符合R0HS要求 Lead-free
TypeRated power 25℃(taken heat sink)Dimensions(mm)Standard heat sinkWeigh
(g)
ABLHII1CMNΦKSurface
Area(cm?)Thickness
(mm)
YRX245W15.51636.5811.412.58.54.41.51.21.341513
10W19.52140.510141611.25222.24156
25W2727481318.32014.37222.253511
30W34295515.5252216.37.3222.253518
50W50297115.5402216.37.3232.299530
75W65.54886.52623.5372711.53.53995390
100W98481192635372711.53.53995160
150W130481512652372711.53.53995240
100W8971.5139457057.246.519.65M52780265
200W927313245355846.5215M63750420
250W1127315245455846.5215M64750480
300W1307317045515846.5215M65780580
500W2047324445875846.5215M68500970
?降功耗曲线POWER DERA TING CURVE
?表面温升 SURFACE TEMPERATURE RISE
?技术说明TECHINICAL SPECIFICATIONS
型号25下℃额定功率(W)阻值范围 RES.RANGES(Ω)温度系数TCR(10/℃)阻值误差(%)耐电压(V)
带散热板不带散热板
RX24-5RE605530.01~1K
RX24-10RE6101080.01~1.5K
RX24-25RE6152512.50.01~10K
RX24-3030150.01~27K
RX24-50RE63050200.01~33K
RX24-7575450.01~39K
RX24-100100500.01~51K
RX24-150150550.01~56K
RX24G-100RE640100500.01~62K
RX24G-2002001000.01~58K
RX24G-2502501200.01~75K
RX24G-3003001500.01~75K
RX24G-5005002000.01~82K
RX24G-250RE6502501200.01~75K
?特性CHARACTERISTICS
实验项目TET ITEM性能要求SPECIFICATIONS试验方法TEST METHOD
SJ1330-78
可焊接性Solderability焊料能自由流动并引线润湿235±5℃,2s槽焊法
引出端强度Terminal tensile strength△R≤±(1%R+0.5Ω)40N
过载Overload△R≤±(1%R+0.5Ω)10PR,5s
温度变化resistance with temperature△R≤±(1%R+0.5Ω)-55℃~+155℃,5次循环
耐焊接热Sold heat△R≤±(1%R+0.5Ω)350±10℃,3.5±0.5S
冲击 Shook△R≤±(1%R+0.5Ω)加速度490m/s2,11ms,18次
振动Vibratious△R≤±(1%R+0.5Ω)频率10-50hz,加速度98m/s2,6h
表面升温Surface temperature Rise≤275℃VR
恒定湿热Dampheat,steady state△R≤±(5%R+0.05Ω)温度40±2℃,温度93%,21天
温度耐久性 Load Life△R≤±(5%R+0.5Ω)室温施加额定功率负荷1000h
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